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MSM5118160D-50TS-L 데이터 시트보기 (PDF) - Oki Electric Industry

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제조사
MSM5118160D-50TS-L
OKI
Oki Electric Industry 
MSM5118160D-50TS-L Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
¡ Semiconductor
PACKAGE DIMENSIONS
SOJ42-P-400-1.27
MSM5118160D/DSL
(Unit : mm)
Mirror finish
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.86 TYP.
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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