NCV87724DT(2011) 데이터 시트보기 (PDF) - ON Semiconductor
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NCV87724DT Datasheet PDF : 17 Pages
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NCV8772
PACKAGE DIMENSIONS
V
S
F
DPAK 5, CENTER LEAD CROP
CASE 175AA
ISSUE A
−T−
SEATING
PLANE
B
C
R
E
R1
A
12 3 4 5
K
Z
U
J
L
H
D 5 PL
G
0.13 (0.005) M T
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.020 0.028
E 0.018 0.023
F 0.024 0.032
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.045 BSC
R 0.170 0.190
R1 0.185 0.210
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 0.170
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.51 0.71
0.46 0.58
0.61 0.81
4.56 BSC
0.87 1.01
0.46 0.58
2.60 2.89
1.14 BSC
4.32 4.83
4.70 5.33
0.63 1.01
0.51 −−−
0.89 1.27
3.93 4.32
SOLDERING FOOTPRINT*
6.4
0.252
2.2
0.086
5.8
0.228
0.34 5.36
0.013 0.217
10.6
0.417
0.8
0.031
ǒ Ǔ SCALE 4:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
15
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