NJM2855
POWER DISSIPATION vs. AMBIENT TEMPERATURE
3500
3000
2500
2000
1500
1000
500
0
-50
NJM2855DL1 PowerDissipation
(Topr=-40~+85°C,Tj=150°C)
on 4 layers board
on 2 layers board
-25
0
25
50
Temperature : Ta(°C)
75
100
TEST CIRCUIT
A IIN
VIN
VOUT
VIN
0.33µF
NJM2855
2.2µF *5
(ceramic)
IOUT V VOU
GND
*5 1.7V<Vo≤2.6V version: Co=4.7µF(ceramic)
Vo≤1.7V version: Co=10µF(ceramic)
TYPICAL APPLICATION
VIN
VIN
VOUT
VOUT
0.33µF
NJM2855
2.2µF *6
GND
*6 1.7V<Vo≤2.6V version: Co=4.7µF
Vo≤1.7V version: Co=10µF
4
Ver.2012-10-24