QSD2030F 데이터 시트보기 (PDF) - Fairchild Semiconductor
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QSD2030F Datasheet PDF : 5 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise specified.
Symbol
Parameter
Min.
Unit
TOPR
TSTG
TSOL-I
TSOL-F
VBR
PD
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)(1,2,3)
Soldering Temperature (Flow)(1,2)
Reverse Breakdown Voltage
Power Dissipation(4)
-40 to +100
-40 to + 100
°C
240 for 5 s
260 for 10 s
50
V
100
mW
Notes:
1. RMA flux is recommended.
2. Methanol or isopropyl alcohols are recommended as cleaning agents.
3. Soldering iron tip 1/16 inch (1.6 mm) minimum from housing.
4. Derate power dissipation linearly 1.33 mW/°C above 25°C.
Electrical / Optical Characteristics
Values are at TA = 25°C unless specified otherwise.
Symbol
Parameter
λPS
Peak Sensitivity Wavelength
λSR
Wavelength Sensitivity Range
Θ
Reception Angle
VF
Forward Voltage
ID
Reverse Dark Current
IL
Reverse Light Current
VO
Open Circuit Voltage
TCV
Temperature Coefficient of VO
ISC
Short Circuit Current
TCI
Temperature Coefficient of ISC
C
Capacitance
tr
Rise Time
tf
Fall Time
Test Conditions Min.
700
IF = 80 mA
VR = 10 V, Ee = 0
Ee = 0.5 mW/cm2,
VR = 5 V, λ = 950 nm
15
Ee = 0.5 mW/cm2,
λ = 880 nm
Ee = 0.5 mW/cm2,
λ = 880 nm
VR = 0, f = 1 MHz, Ee = 0
VR = 5 V, RL = 50 Ω,
λ = 950 nm
Typ.
880
±20
1.3
25
420
+0.6
50
+0.3
60
5
5
Max.
1100
Units
nm
nm
o
V
10
nA
μA
mV
mV/K
μA
%/K
pF
ns
© 2005 Fairchild Semiconductor Corporation
QSD2030F Rev. 1.2.0
2
www.fairchildsemi.com
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