ST7636
3. ST7636 Pad Arrangement (COG)
Chip Size: 20,050 um x1,650 um
Bump Pitch:
PAD NO 1 ~ 496, 661~692: 40 um (COM/SEG)
PAD NO 497 ~ 660: 110 um (O)
Bump size:
PAD NO.1~464: 25(x)um X 96(y)um
PAD No.465~ 496,661~692: 96(x)um X 25(y)um
PAD N0. 497~660: 90(x)um X 40(y)um
Bump Height: 17um
Chip Thickness: 635um
Ver 1.3
2/99
2006/08/15