HI5813 데이터 시트보기 (PDF) - Intersil

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HI5813

CMOS 3.3V, 25 Microsecond, 12-Bit, Sampling A/D Converter with Internal Track and Hold

Intersil 

Die Characteristics

DIE DIMENSIONS:

3200µm x 3940µm

METALLIZATION:

Type: AlSi

Thickness: 11kÅ ±1kÅ

Metallization Mask Layout

D1

D2

D3

D4

HI5813

PASSIVATION:

Type: PSG

Thickness: 13kÅ ±2.5kÅ

WORST CASE CURRENT DENSITY:

1.84 x 105 A/cm2

D0

(LSB)

HI5813

DRDY VDD OEL

CLK

STRT

VREF -

D5

D6

VREF +

D7

D8

D9

VSS

D10

D11

OEM

(MSB)

VIN

VAA +

VAA -

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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

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