TS4601B 데이터 시트보기 (PDF) - STMicroelectronics
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TS4601B
STMicroelectronics
TS4601B Datasheet PDF : 28 Pages
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TS4601B
5
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 53. TS4601B footprint recommendation
Φ=250μm
500μm
500μm
75µm min.
100μm max.
Track
Φ=400μm typ.
Φ=340μm min.
150μm min.
Non Solder mask opening
Pad in Cu 18μm with Flash NiAu (2-6μm, 0.2μm max.)
Figure 54. Pinout
Top view
Bottom view
SDZ
SDA
SCL
VOUTR D
D VOUTR
SCL
SDA
SDZ
INR-
INR+
CMS
VCC C
C VCC
CMS
INR+
INR-
INL-
INL+
PVSS
VOUTL B
B VOUTL
PVSS
INL+
INL-
PVCC
GND
C1
C2
A
4
3
2
1
Balls are underneath
A C2
1
C1
GND
PVCC
2
3
4
25/28
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