LTC2451IDDB 데이터 시트보기 (PDF) - Linear Technology

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LTC2451IDDB

Ultra-Tiny, 16-Bit DS ADC with I2C Interface

Linear Technology 

LTC2451

PACKAGE DESCRIPTION

DDB Package

8-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1702 Rev B)

0.61 p0.05

(2 SIDES)

0.70 p0.05

3.00 p0.10

(2 SIDES)

R = 0.05

TYP

R = 0.115

TYP

5

0.40 p 0.10

8

2.55 p0.05

1.15 p0.05

0.25 p 0.05

0.50 BSC

PACKAGE

OUTLINE

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

2.00 p0.10

(2 SIDES)

0.75 p0.05

0.56 p 0.05

(2 SIDES)

4

0.25 p 0.05

PIN 1

R = 0.20 OR

0.25 s 45o

CHAMFER

1

(DDB8) DFN 0905 REV B

0.50 BSC

2.20 p0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0 – 0.05

2.15 p0.05

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

2451ff

15

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