Revision History
Rev. Code: Old;
New
GS840H18/32/36 Rev 1.02c 5/
1999;
GS840H18/32/36 2.00 8/1999D
GS840H18/32/362.00 8/
1999;GS840H18/32/362.01 9/
1999E
GS840H18/32/362.01 9/
1999E;GS840H18/32/362.02
GS840H18/32/36T/B-180/166/150/100
Types of Changes
Format or Content
Format/Typos
Content
Format/Typos
Content
Page /Revisions;Reason
• Document/Continued changing to new format.
• Added Fine Pitch BGA Package.
•
• Took “E” out of 840HE...in Core and Interface Voltages.
• Pin outs/New small caps format.
• Timing Diagrams/New format.
• Block Diagrams/New small caps format.
• Pin outs/x32 & x36 TQFP/Changed pin 72 from DQA3 to DQB3.
• Pin Description/Rearranged Address Inputs to match order on TQFP Pinout.
• TQFP Package Diagram/Corrected Dimension D Max from 20.1 to 22.1.
• Corrected ordering information.
•
• Took out Fine Pitch BGA Package. Package change in progress.
GS840H18/32/362.0210-11/
1999;GS840H18/32/362.032/
2000G
GS840E18/32/362.032/2000G;
840H18_r2_04
Format
Content
• New GSI Logo
• Took “Pin” out of heading for consistency.
• Updated BGA pin description table to meet JEDEC standard
Rev: 2.04 6/2000
31/31
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
© 1999, Giga Semiconductor, Inc.