ZXMN4A06G
ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated)
PARAMETER
STATIC
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Source Threshold Voltage
Static Drain-Source On-State
Resistance (1)
Forward Transconductance (3)
DYNAMIC (3)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING(2) (3)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)
Reverse Recovery Time (3)
Reverse Recovery Charge (3)
SYMBOL MIN. TYP. MAX. UNIT
CONDITIONS.
V(BR)DSS
IDSS
IGSS
VGS(th)
RDS(on)
gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
VSD
trr
Qrr
40
V ID=250A, VGS=0V
1
A VDS=40V, VGS=0V
100
nA VGS=±20V, VDS=0V
1.0
V
I =250A,
D
VDS=
VGS
0.050
0.075
⍀ VGS=10V, ID=4.5A
⍀ VGS=4.5V, ID=3.2A
8.7
S VDS=15V,ID=2.5A
770
pF
92
pF
VDS=40 V, VGS=0V,
f=1MHz
61
pF
2.55
4.45
28.61
7.35
18.2
2.1
4.5
ns
ns VDD =30V, ID=2.5A
ns
RG=6.0⍀, VGS=10V
(refer to test circuit)
ns
nC VDS=30V,VGS=10V,
nC ID=2.5A
nC (refer to test circuit)
0.8 0.95
19.86
16.36
V TJ=25°C, IS=2.5A,
VGS=0V
ns TJ=25°C, IF=2.5A,
nC di/dt= 100A/µs
NOTES
(1) Measured under pulsed conditions. Width≤300µs. Duty cycle ≤ 2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
ISSUE 1 - MAY 2002
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