FAN501A 데이터 시트보기 (PDF) - Fairchild Semiconductor
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FAN501A Datasheet PDF : 16 Pages
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Physical Dimensions
4.0
0.10 C
PIN#1 QUADRANT
TOP VIEW
A
B
3.0
0.10 C
0.80 MAX
0.10 C
0.08 C 0.05
0.00
FRONT VIEW
(0.20)
C
SEATING
PLANE
0.30
1
0.80
3.60
2
3
0.36
4.60
1.80
0.80
10 9
8
1.58
7
0.40 (10X)
1.60
45
0.80
6
0.45
0.65 (10X)
RECOMMENDED LAND PATTERN
0.30
3
0.80
2
1
0.36
1.85
1.75
0.80
45
0.45
6
7
1.63
1.53
8
SIDE VIEW
10
PIN #1 IDENT
CHAMFER 0.25 mm
9
0.35(10X)
0.30(10X)
0.10 C A B
0.05 C
SIDE VIEW
A. DOES NOT FULLY CONFORM TO
JEDEC REGISTRATION, MO-220.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY
E. DRAWING FILE NAME : MKT-MLP10Hrev1
BOTTOM VIEW
Figure 36. 10-Lead, MLP, QUAD, JEDEC MO-220 4 mm X 3 mm, 0.8 mm Pitch, Single DAP
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/ML/MLP10H.pdf.
For current packing container specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-MLP10H.pdf.
© 2014 Fairchild Semiconductor Corporation
FAN501A • Rev. 1.0.0
15
www.fairchildsemi.com
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