LQH32DN1R0M53L 데이터 시트보기 (PDF) - Unspecified
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LQH32DN1R0M53L Datasheet PDF : 7 Pages
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SpecNo.JELF243A-0118A-01
Reference Only
P2/7
6.Electrical Performance
No.
Item
Specification
6.1 Inductance
Inductance shall meet item 3.
Test Method
Measuring Equipment : KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter
6.3 Self Resonant
S.R.F shall meet item 3.
Frequency(S.R.F)
Measuring Equipment : KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No.
Item
Specification
7.1 Shear Test
Chip coil shall not be damaged.
Test Method
Substrate:Glass-epoxy substrate
Applied Direction : Chip coil
Ｆ
7.2 Bending Test
7.3 Vibration
7.4 Solderability
Substrate
Force:10N
Hold Duration:5±1s
Substrate:Glass-epoxy substrate (100×40×1.6mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:5s
Pressure jig
R230 F
Deflection
45
45
Product
(in mm)
Oscillation Frequency : 10Hz~55Hz~10Hz
for 1 minute
Total amplitude 1.5 mm
Testing Time:A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature:240±5°C
Immersion Time: 3±1 s
MURATA MFG.CO., LTD
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