IRL3803S/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(on)
VGS(th)
gfs
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
30 V VGS = 0V, ID = 250µA
0.052 V/°C Reference to 25°C, ID = 1mA
0.006
VGS = 10V, ID = 71A
0.009 Ω VGS = 4.5V, ID = 59A
1.0
V VDS = VGS, ID = 250µA
55
25
250
S VDS = 25V, ID = 71A
µA VDS = 30V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 150°C
100
-100
nA
VGS = 16V
VGS = -16V
140
ID = 71A
41 nC VDS = 24V
78
VGS = 4.5V, See Fig. 6 and 13
14
VDD = 15V
230
ID = 71A
29
RG = 1.3Ω
35
RD = 0.20Ω, See Fig. 10
7.5 nH Between lead,
and center of die contact
5000
VGS = 0V
1800 pF VDS = 25V
880
= 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
(Body Diode)
I SM
Pulsed Source Current
(Body Diode)
MOSFET symbol
D
140
A
showing the
integral reverse
G
470
p-n junction diode.
S
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
1.3
120 180
V TJ = 25°C, IS = 71A, VGS = 0V
ns TJ = 25°C, IF = 71A
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
450 680 nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
Pulse width ≤ 300µs; duty cycle ≤ 2%.
max. junction temperature. ( See fig. 11 )
VDD = 15V, starting TJ = 25°C, L = 180µH
RG = 25Ω, IAS = 71A. (See Figure 12)
Uses IRL3803 data and test conditions.
Calculated continuous current based on maximum allowable
ISD ≤ 71A, di/dt ≤ 130A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
junction temperature;for recommended current-handling of the
package refer to Design Tip # 93-4
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
2
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