MSM6652-XXX 데이터 시트보기 (PDF) - Oki Electric Industry

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MSM6652-XXX

Internal Mask ROM Voice Synthesis IC, Internal One-Time-Programmable (OTP) ROM Voice Synthesis IC, External ROM Drive Voice Synthesis IC

Oki Electric Industry 

¡ Semiconductor

QFP64-P-1420-1.00-BK

FEDL6650-03

MSM6650 Family

(Unit : mm)

Mirror finish

Oki Electric Industry Co., Ltd.

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Notes for Mounting the Surface Mount Type Package

Epoxy resin

42 alloy

Solder plating (≥5 mm)

1.25 TYP.

4/Nov. 28, 1996

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type

packages, which are very susceptible to heat in reflow mounting and humidity absorbed in

storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person

on the product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

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