SPP15N60CFD
Parameter
Symbol Conditions
Thermal characteristics
Thermal resistance, junction - case
Thermal resistance, junction -
ambient
R thJC
R thJA
leaded
Soldering temperature, wave
soldering only allowed at leads
T sold
1.6 mm (0.063 in.)
from case for 10 s
Electrical characteristics, at T j=25 °C, unless otherwise specified
Values
Unit
min. typ. max.
-
-
0.8 K/W
-
-
62
-
-
260 °C
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=250 µA
600
-
Avalanche breakdown voltage
V (BR)DS V GS=0 V, I D=13.4 A
-
700
Gate threshold voltage
V GS(th) V DS=V GS, I D=750 µA
3
4
-V
-
5
Zero gate voltage drain current
I DSS
V DS=600 V, V GS=0 V,
T j=25 °C
-
V DS=600 V, V GS=0 V,
T j=150 °C
-
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=9.4 A,
T j=25 °C
-
Gate resistance
Transconductance
V GS=10 V, I D=9.4 A,
T j=150 °C
-
RG
f =1 MHz, open drain
-
g fs
|V DS|>2|I D|R DS(on)max,
I D=9.4 A
-
1.4
- µA
1200
-
-
100 nA
0.28 0.33 "
0.78
-
1.3
-
8
-S
Rev. 1.3
page 2
2009-11-30