SA616DK/01 데이터 시트보기 (PDF) - NXP Semiconductors.
부품명
상세내역
제조사
SA616DK/01 Datasheet PDF : 31 Pages
| |||
NXP Semiconductors
SA616
Low-voltage high performance mixer FM IF system
6.2 Pin description
Table 2. Pin description
Symbol
Pin
SSOP20
RF_IN
1
RF_IN_DECOUPL
2
OSC_OUT
3
OSC_IN
4
RSSI_OUT
5
VCC
6
AUDIO_FEEDBACK
7
AUDIO_OUT
8
RSSI_FEEDBACK
9
QUADRATURE_IN
10
LIMITER_OUT
11
LIMITER_DECOUPL 12
LIMITER_DECOUPL 13
LIMITER_IN
14
GND
15
IF_AMP_OUT
16
IF_AMP_DECOUPL
17
IF_AMP_IN
18
IF_AMP_DECOUPL
19
MIXER_OUT
20
-
-
HVQFN20
19
20
1
2
3
4
5
6
7
8
9
10
11
12
13[1]
14
15
16
17
18
DAP
Description
RF input
RF input decoupling pin
oscillator output
oscillator input
RSSI output
positive supply voltage
audio amplifier negative feedback terminal
audio amplifier output
RSSI amplifier negative feedback terminal
quadrature detector input terminal
limiter amplifier output
limiter amplifier decoupling pin
limiter amplifier decoupling pin
limiter amplifier input
ground; negative supply
IF amplifier output
IF amplifier decoupling pin
IF amplifier input
IF amplifier decoupling pin
mixer output
exposed die attach paddle
[1] HVQFN20 package supply ground is connected to both GND pin and exposed center pad. GND pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
SA616
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 June 2010
© NXP B.V. 2010. All rights reserved.
4 of 31
Share Link: 