HS-26CT31EH 데이터 시트보기 (PDF) - Intersil
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HS-26CT31EH Datasheet PDF : 4 Pages
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HS-26CT31RH, HS-26CT31EH
Die Characteristics
DIE DIMENSIONS:
96.5 milx195 milsx21 mils
(2450x4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 10kÅ ± 1kÅ
Metallization:
M1: Mo/TiW
Thickness: 5800Å
M2: Al/Si/Cu (Top)
Thickness: 10kÅ ±1kÅ
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0x105A/cm2
Bond Pad Size:
110µmx100µm
3
FN2929.4
February 23, 2012
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