S29GL064N90BAI040(2007) 데이터 시트보기 (PDF) - Spansion Inc.

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S29GL064N90BAI040
(Rev.:2007)

64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology

Spansion Inc. 

Data Sheet

7. Ordering Information–S29GL064N

S29GL064N Standard Products

Standard products are available in several packages and operating ranges. The order number (Valid

Combination) is formed by a combination of the following:

S29GL064N 90 T A I 02 2

PACKING TYPE

0 = Tray

2 = 7-inch Tape and Reel

3 = 13-inch Tape and Reel

MODEL NUMBER

01 =

02 =

03 =

04 =

06 =

07 =

V1 =

V2 =

V6 =

V7 =

x8/x16, VCC = VIO = 2.7 – 3.6 V, Uniform sector, WP#/ACC = VIL protects highest addressed sector

x8/x16, VCC = VIO = 2.7 – 3.6 V, Uniform sector, WP#/ACC = VIL protects lowest addressed sector

x8/x16, VCC = 2.7 – 3.6 V, Top boot sector, WP#/ACC = VIL protects top two addressed sectors

x8/x16, VCC = 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = VIL protects bottom two addressed sectors

x16, VCC = 2.7 – 3.6 V, Uniform sector, WP# = VIL protects highest addressed sector

x16, VCC = 2.7 – 3.6 V, Uniform sector, WP# = VIL protects lowest addressed sector

x8/x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP#/ACC = VIL protects highest addressed sector

x8/x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP#/ACC = VIL protects lowest addressed sector

x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP# = VIL protects highest addressed sector

x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP# = VIL protects lowest addressed sector

TEMPERATURE RANGE

I = Industrial (–40°C to +85°C)

PACKAGE MATERIAL SET

A = Standard (Note 4)

F = Pb-Free

PACKAGE TYPE

T = Thin Small Outline Package (TSOP) Standard Pinout

B = Fine-pitch Ball-Grid Array Package

F = Fortified Ball-Grid Array Package

SPEED OPTION

See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)

DEVICE NUMBER/DESCRIPTION

S29GL064N, 64 Megabit Page-Mode Flash Memory

Manufactured using 110 nm MirrorBit® Process Technology, 3.0 Volt-only Read, Program, and Erase

Table 7.1 S29GL064N Valid Combinations (Note 4)

Device Number

S29GL064N Valid Combinations

Speed Option

Package, Material &

Temperature Range

Model Number

Packing

Type

Package Description

90

11

TFI

90

S29GL064N

11

90

BFI

03, 04, 06, 07

V6, V7

01, 02

V1, V2

03, 04

TS048 (Note 2)

TSOP

0, 2, 3

(Note 1)

TS056 (Note 2)

VBK048 (Note 3)

TSOP

Fine-pitch BGA

90

FFI

11

01, 02, 03, 04

V1, V2

LAA064 (Note 3) Fortified BGA

Notes

1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be

packed in Types 0, 2, or 3.

2. TSOP package marking omits packing type designator from ordering part number.

3. BGA package marking omits leading S29 and packing type designator from ordering part number.

4. Contact local sales for availability for Leaded lead-frame parts.

Valid Combinations

Valid Combinations list configurations

planned to be supported in volume for this

device. Consult your local sales office to

confirm availability of specific valid

combinations and to check on newly

released combinations.

8. Device Bus Operations

This section describes the requirements and use of the device bus operations, which are initiated through the

internal command register. The command register itself does not occupy any addressable memory location.

The register is a latch used to store the commands, along with the address and data information needed to

16

S29GL-N MirrorBit® Flash Family

S29GL-N_01_09 November 16, 2007

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