LM258AN(2005) 데이터 시트보기 (PDF) - STMicroelectronics

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LM258AN
(Rev.:2005)

Low Power Dual Operational Amplifiers

STMicroelectronics 

Package Mechanical Data

LM158-LM258-LM358-LM158A-LM258A-LM358A

5 Package Mechanical Data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.

These packages have a Lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com..

5.1 DIP8 Package

DIM.

A

a1

B

B1

b

b1

D

E

e

e3

e4

F

I

L

Z

Plastic DIP-8 MECHANICAL DATA

MIN.

0.7

1.39

0.91

0.38

0.44

mm.

TYP

3.3

0.5

8.8

2.54

7.62

7.62

3.3

MAX.

1.65

1.04

0.5

9.8

7.1

4.8

1.6

MIN.

0.028

0.055

0.036

0.015

0.017

inch

TYP.

0.130

0.020

0.346

0.100

0.300

0.300

0.130

MAX.

0.065

0.041

0.020

0.386

0.280

0.189

0.063

12/16

P001F

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