MC33887VW 데이터 시트보기 (PDF) - Freescale Semiconductor
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MC33887VW Datasheet PDF : 37 Pages
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ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
A
Tab
AGND 1
FS 2
IN1 3
V+ 4
V+ 5
OUT1 6
OUT1 7
FB 8
PGND 9
PGND 10
20
EN
19
IN2
18
D1
17
CCP
16
V+
15
OUT2
14
OUT2
13
D2
12
PGND
11
PGND
Tab
33887 Pin Connections
20-Pin HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
Figure 26. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 8. Thermal Resistance Performance
Thermal Resistance
Area A (mm2)
°C/W
RθJA
0.0
52
300
36
600
32
RθJS
0.0
10
300
7.0
600
6.0
RθJA is the thermal resistance between die junction and
ambient air.
RθJS is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see Figure 26).
33887
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
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