STPS1L40A/U
Fig. 9-1: Forward voltage drop versus forward
current (maximum values, high level).
IFM(A)
10.00
1.00
Tj=125°C
(typical
values)
Tj=125°C
Tj=25°C
0.10
VFM(mV)
0.01
0 50 100 150 200 250 300 350 400 450 500 550 600 650 700
Fig. 9-2: Forward voltage drop versus forward
current (maximum values, low level).
IFM(A)
3.0
2.5
2.0
1.5
Tj=125°C
Tj=125°C
(typical values)
Tj=25°C
1.0
0.5
0.0
0
VFM(mV)
50 100 150 200 250 300 350 400 450 500
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness
s(Cu) = 35µm)
Rth(j-a) (°C/W)
120
100
80
60
40
20
S(Cu) (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/5