STPS1L40
Figure 13: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Rth(j-a)(°C/W)
200
SMB
150
100
50
Epoxy printed board FR4, eCu = 35 µm
SCu (cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Characteristics
Figure 14: Thermal resistance junction to ambient
versus copper surface under tab (typical values)
Rth(j-a)(°C/W)
250
200
SOD123Flat
150
100
Epoxy printed board FR4, eCu = 35 µm
50
SCu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DocID5507 Rev 7
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