Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD to ACOM
DVDD to DCOM
CLKVDD to CLKCOM
ACOM to DCOM
ACOM to CLKCOM
DCOM to CLKCOM
AVDD to DVDD
AVDD to CLKVDD
DVDD to CLKVDD
SLEEP to DCOM
Digital Inputs, MODE to DCOM
IOUTA, IOUTB to ACOM
REFIO, FS ADJ, OTCM to ACOM
CLK+, CLK–, CMODE to CLKCOM
Junction Temperature
Storage Temperature Range
Lead Temperature (10 sec)
Rating
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−3.9 V to +3.9 V
−3.9 V to +3.9 V
−3.9 V to +3.9 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−1.0 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
150°C
−65°C to +150°C
300°C
AD9704/AD9705/AD9706/AD9707
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
Thermal impedance measurements were taken on a 4-layer board
in still air, in accordance with EIA/JESD51-7.
Table 8. Thermal Resistance
Package Type
32-Lead LFCSP
θJA
Unit
32.5
°C/W
ESD CAUTION
Rev. D | Page 11 of 42