HCTS190MS 데이터 시트보기 (PDF) - Intersil

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HCTS190MS

Radiation Hardened Synchronous 4-Bit Up/Down Counter

Intersil 

Die Characteristics

DIE DIMENSIONS:

104 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS190MS

HCTS190MS

Q0 (3)

CE (4)

U/D (5)

Q2 (6)

Q3 (7)

(15) P0

(14) CP

(13) RC

(12) TC

(11) PL

NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS190 is TA14444A.

Spec Number 518614

10

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