CXP81960 데이터 시트보기 (PDF) - Sony Semiconductor

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CXP81960

CMOS 8-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

100PIN QFP (PLASTIC)

23.9 ± 0.4

+ 0.4

20.0 – 0.1

+ 0.1

0.15 – 0.05

CXP81952/81960

0.65

±0.12 M

0.15

A

+ 0.35

2.75 – 0.15

0° to 15°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-100P-L01

∗QFP100-P-1420-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

EPOXY RESIN

SOLDER PLATING

LEAD MATERIAL

PACKAGE WEIGHT

COPPER / 42 ALLOY

1.4g

75

76

100PIN LQFP (PLASTIC)

16.0 ± 0.2

∗ 14.0 ± 0.1

51

50

100

1

0.5 ± 0.08

+ 0.08

0.18 – 0.03

0.1 ± 0.1

A

26 (0.22)

25

+ 0.2

1.5 – 0.1

+ 0.05

0.127 – 0.02

0.1

0° to 10°

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

DETAIL A

LQFP-100P-L01

∗QFP100-P-1414-A

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY/PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 ALLOY

PACKAGE WEIGHT

– 27 –

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