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NTD3055L104-1 Datasheet PDF : 8 Pages
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NTD3055L104
Power MOSFET
12 Amps, 60 Volts, Logic Level
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
• Lower RDS(on)
• Lower VDS(on)
• Tighter VSD Specification
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 MW)
Gate−to−Source Voltage, Continuous
− Non−Repetitive (tpv10 ms)
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
60 Vdc
VDGR
60
Vdc
VGS
"15 Vdc
VGS
"20
ID
ID
IDM
PD
TJ, Tstg
12
10
45
48
0.32
2.1
1.5
−55 to
+175
Adc
Apk
W
W/°C
W
W
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, L = 1.0 mH
IL(pk) = 11 A, VDS = 60 Vdc)
Thermal Resistance, − Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
61
mJ
RqJC
RqJA
RqJA
TL
3.13 °C/W
71.4
100
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size,
(Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in2).
http://onsemi.com
V(BR)DSS
60 V
RDS(on) TYP
104 mW
ID MAX
12 A
N−Channel
D
G
S
MARKING
DIAGRAMS
12
3
4
DPAK
CASE 369C
STYLE 2
4
Drain
1
Gate
2
Drain
3
Source
4
DPAK−3
CASE 369D
STYLE 2
4
Drain
1
2
3
12 3
Gate Drain Source
55L104
A
Y
W
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
1
June, 2008 − Rev. 6
Publication Order Number:
NTD3055L104/D
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