W83977CTF 데이터 시트보기 (PDF) - Winbond
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W83977CTF Datasheet PDF : 161 Pages
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16.0 PACKAGE DIMENSIONS
(128-pin PQFP)
102
103
HE
E
65
64
D HD
128
1
e
b
See Detail F
Seating Plane
39
38
A
A2
A1
y
c
L
L1
Detail F
W83977EF/ CTF
PRELIMINARY
Symbol
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Min
0.25
2.57
0.10
0.10
13.90
19.90
17.00
23.00
0.65
0
Dimension in mm
Nom
Max
0.35
0.45
2.72
2.87
0.20
0.30
0.15
0.20
14.00
14.10
20.00
0.50
20.10
17.20
23.20
0.80
1.60
17.40
23.40
0.95
0.08
7
Dimension in inch
Min Nom Max
0.010 0.014 0.018
0.101 0.107 0.113
0.004 0.008 0.012
0.004 0.006 0.008
0.547 0.551 0.555
0.783 0.787 0.791
0.020
0.669 0.677 0.685
0.905 0.913 0.921
0.025 0.031 0.037
0.063
0.003
0
7
Note:
1.Dimension D & E do not include interlead
flash.
2.Dimension b does not include dambar
protrusion/intrusion .
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
on final visual inspection spec.
5. PCB layout please use the "mm".
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792646
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their original
owners.
-152 -
Publication Release Date: March 1999
Revision A1
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