HSDL-3201-008 데이터 시트보기 (PDF) - LiteOn Technology

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HSDL-3201-008

IrDA® Data 1.4 Low Power Compliant 115.2 kb/s Infrared Transceiver

LiteOn Technology 

Moisture Proof Packaging

The HDSL-3201 is shipped in moisture

proof packaging. Once opened,

moisture absorption begins.

This part is compliant to JEDEC Level

43..

Recommended Storage

Conditions

Storage

Temperature

10°C to 30°C

Relative

Humidity

below 60% RH

Recommended Land Pattern for HSDL-3201#021

(Front Options)

CL

MOUNTING

CENTER

1.35

SHIELD

SOLDER PAD

1.25

2.05

0.10

0.775

1.75

Time from Unsealing to

Soldering

After removal from the bag, the parts

should be soldered within th7ree days

if stored at the recommended storage

conditions.

0.60

UNIT: mm

0.475

1.425

2.375

3.325

FIDUCIAL

Baking

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage to

the parts.

Package

In reels

;; ;; Inbulk

Temp.

60°C

100°C

125°C

150°C

Time

≥ 48 hours

≥ 4 hours

≥ 2 hours

≥ 1 hour

Recommended Land Pattern for HSDL-3201#008

(Top Options)

2.20

1.45

0.9

;;;;; Baking should only be done once.

1.275

MOUNTING CENTER

0.575

;;;;;;;;;;;1.60

0.60

PITCH 7 x 0.95

3.625

11

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