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26102AVZ 데이터 시트보기 (PDF) - Renesas Electronics

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26102AVZ
Renesas
Renesas Electronics 
26102AVZ Datasheet PDF : 21 Pages
First Prev 21
ISL26102, ISL26104
Package Outline Drawing
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A
13
9.70± 0.10
28
15
6.40
4.40 ± 0.10
2
3
PIN #1
I.D. MARK
SEE DETAIL "X"
0.20 C B A 1
H
C
SEATING PLANE
0.10 C
14
0.65
B
TOP VIEW
0.15 +0.05
-0.06
END VIEW
- 0.05
SIDE VIEW
1.20 MAX
0.90 +0.15
-0.10
0.25+-00..0065
5
0.10 M C B A
0.05 MIN
0.15 MAX
1.00 REF
GAUGE
PLANE
0.25
0°-8°
0.60 ±0.15
DETAIL "X"
(5.65)
(1.45)
NOTES:
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
FN7608 Rev 0.00
October 12, 2012
Page 21 of 21

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