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ISL6251 데이터 시트보기 (PDF) - Renesas Electronics

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ISL6251 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ISL6251, ISL6251A
Package Outline Drawing
M24.15
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE (QSOP/SSOP)
0.150” WIDE BODY
Rev 3, 2/13
24
INDEX
AREA
5
1
TOP VIEW
-A- 8.74 3
8.55
SEATING PLANE
1.75
1.35
-C-
0.635 BSC
SIDE VIEW 1
0.30
7 0.20
0.17(0.007) M C A M B S
0.25
0.10
0.10(0.004)
3.98
3.81 4
-B-
6.19
5.80
0.25(0.010) M B M
DETAIL “X”
GAUGE
PLANE
1.27
0.41
0.25
0.010
0.49
0.26
x
45°
5
7.11
5.59
4.06
0.38
0.635
TYPICAL RECOMMENDED LAND PATTERN
1.54
0.25
0.18
SIDE VIEW 2
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication
Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Package length does not include mold flash, protrusions or gate burrs. Mold
flash,
protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Package width does not include interlead flash or protrusions. Interlead flash and
protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature
must be located within the crosshatched area.
6. Terminal numbers are shown for reference only.
7. Lead width does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm (0.004 inch) total in excess of “B” dimension at maximum mate-
rial condition.
8. Controlling dimension: MILLIMETER.
FN9202 Rev 3.00
March 13, 2014
Page 20 of 20

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