SMBYW02-200
Fig. 7: Capacitance versus reverse voltage
applied.
Fig. 8: Recovery time versus dIF/dt.
Fig. 9: Peak reverse current versus dIF/dt.
Fig. 10: Dynamic parameters versus junction
temperature.
Fig. 11: Thermal resistance junction to ambient
versus copper surface under each lead.
100 Rth(j-a)
90
Printed circuit : epoxy (e=35 µm)
80
70
60
50
40
30
20
10
Scu(cm2 )
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/5