AM29LV256MH103RPGF 데이터 시트보기 (PDF) - Advanced Micro Devices

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AM29LV256MH103RPGF

256 Megabit (16 M x 16-Bit/32 M x 8-Bit) MirrorBit™ 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O™ Control

Advanced Micro Devices 

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TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5

Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Device Bus Operations ....................................................... 9

Word/Byte Configuration .......................................................... 9

VersatileIOTM (VIO) Control ........................................................ 9

Requirements for Reading Array Data ................................... 10

Page Mode Read ............................................................................10

Writing Commands/Command Sequences ............................ 10

Write Buffer .....................................................................................10

Accelerated Program Operation ......................................................10

Autoselect Functions .......................................................................10

Standby Mode ........................................................................ 10

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 11

Table 2. Sector Address Table........................................................ 12

Autoselect Mode ..................................................................... 23

Table 3. Autoselect Codes, (High Voltage Method) ....................... 23

Sector Group Protection and Unprotection ............................. 24

Table 4. Sector Group Protection/Unprotection Address Table ..... 24

Write Protect (WP#) ................................................................ 26

Temporary Sector Group Unprotect ....................................... 26

Figure 1. Temporary Sector Group Unprotect Operation ................26

Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...27

SecSi (Secured Silicon) Sector Flash Memory Region .......... 28

Table 5. SecSi Sector Contents ...................................................... 28

................................................................................................ 29

Figure 3. SecSi Sector Protect Verify ..............................................29

Hardware Data Protection ...................................................... 29

Low VCC Write Inhibit .....................................................................29

Write Pulse “Glitch” Protection ........................................................29

Logical Inhibit ..................................................................................29

Power-Up Write Inhibit ....................................................................29

Common Flash Memory Interface (CFI) . . . . . . . 29

Table 6. CFI Query Identification String ..........................................30

Table 7. System Interface String..................................................... 30

Table 8. Device Geometry Definition ..............................................31

Table 9. Primary Vendor-Specific Extended Query ........................32

Command Definitions . . . . . . . . . . . . . . . . . . . . . 32

Reading Array Data ................................................................ 32

Reset Command ..................................................................... 33

Autoselect Command Sequence ............................................ 33

Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 33

Word/Byte Program Command Sequence ............................. 33

Unlock Bypass Command Sequence ..............................................34

Write Buffer Programming ...............................................................34

Accelerated Program ......................................................................35

Figure 4. Write Buffer Programming Operation ...............................36

Figure 5. Program Operation ..........................................................37

Program Suspend/Program Resume Command Sequence ... 37

Figure 6. Program Suspend/Program Resume ...............................38

Chip Erase Command Sequence ........................................... 38

Sector Erase Command Sequence ........................................ 38

Table 10. Erase Operation ............................................................. 39

Erase Suspend/Erase Resume Commands ........................... 39

Command Definitions ............................................................. 40

Table 11. Command Definitions (x16 Mode, BYTE# = VIH) ........... 40

Table 12. Command Definitions (x8 Mode, BYTE# = VIL).............. 41

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 42

DQ7: Data# Polling ................................................................. 42

Figure 7. Data# Polling Algorithm .................................................. 42

RY/BY#: Ready/Busy# ............................................................ 43

DQ6: Toggle Bit I .................................................................... 43

Figure 8. Toggle Bit Algorithm ........................................................ 44

DQ2: Toggle Bit II ................................................................... 44

Reading Toggle Bits DQ6/DQ2 ............................................... 44

DQ5: Exceeded Timing Limits ................................................ 45

DQ3: Sector Erase Timer ....................................................... 45

DQ1: Write-to-Buffer Abort ..................................................... 45

Table 13. Write Operation Status................................................... 45

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 46

Figure 9. Maximum Negative Overshoot Waveform ..................... 46

Figure 10. Maximum Positive Overshoot Waveform ..................... 46

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 46

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 47

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 11. Test Setup ..................................................................... 48

Table 14. Test Specifications ......................................................... 48

Key to Switching Waveforms. . . . . . . . . . . . . . . . 48

Figure 12. Input Waveforms and

Measurement Levels ...................................................................... 48

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 49

Read-Only Operations ........................................................... 49

Figure 13. Read Operation Timings ............................................... 49

Figure 14. Page Read Timings ...................................................... 50

Hardware Reset (RESET#) .................................................... 51

Figure 15. Reset Timings ............................................................... 51

Erase and Program Operations .............................................. 52

Figure 16. Program Operation Timings .......................................... 53

Figure 17. Accelerated Program Timing Diagram .......................... 53

Figure 18. Chip/Sector Erase Operation Timings .......................... 54

Figure 19. Data# Polling Timings (During Embedded Algorithms) . 55

Figure 20. Toggle Bit Timings (During Embedded Algorithms) ...... 56

Figure 21. DQ2 vs. DQ6 ................................................................. 56

Temporary Sector Unprotect .................................................. 57

Figure 22. Temporary Sector Group Unprotect Timing Diagram ... 57

Figure 23. Sector Group Protect and Unprotect Timing Diagram .. 58

Alternate CE# Controlled Erase and Program Operations ..... 59

Figure 24. Alternate CE# Controlled Write (Erase/Program)

Operation Timings .......................................................................... 60

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 60

Erase And Programming Performance. . . . . . . . 61

TSOP Pin and BGA Package Capacitance . . . . . 61

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 63

TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline

Package (TSOP) ..................................................................... 63

LAC064—64-Ball Fortified Ball Grid Array

18 x 12 mm Package .............................................................. 64

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 65

December 16, 2005

Am29LV256M

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