ADG5208F 데이터 시트보기 (PDF) - Analog Devices
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ADG5208F Datasheet PDF : 27 Pages
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Data Sheet
ADG5208F/ADG5209F
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
Figure 53. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
4.10
4.00 SQ
3.90
TOP VIEW
0.65
BSC
0.45
0.40
0.35
0.35
0.30
0.25
13
16
12
1
EXPOSED
PAD
4
9
8
5
BOTTOM VIEW
PIN 1
INDICATOR
2.70
2.60 SQ
2.50
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-17)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADG5208FBCPZ-RL7
ADG5208FBRUZ
ADG5208FBRUZ-RL7
ADG5209FBCPZ-RL7
ADG5209FBRUZ
ADG5209FBRUZ-RL7
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Package Option
CP-16-17
RU-16
RU-16
CP-16-17
RU-16
RU-16
©2015–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13035-0-3/16(A)
Rev. A | Page 27 of 27
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