B130E 데이터 시트보기 (PDF) - Weitron Technology

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B130E

Schottky Barrier Rectifiers

Weitron Technology 

B120E thru B1200E

5.Suggested thermal profile for soldering process

1. Storage environment Temperature=5~40 ℃ Humidity=55±25%

2. Reflow soldering of surface-mount device

Pt

TP

Ramp-up

TL

Ts max

TL

Ts min

ts preheat

Ramp-down

Critical Zone

TL to TP

25

t25℃ to Peak

time

3. Reflow soldering

Profile Feature

Average ramp-up rate(TL to TP)

Preheat

- Temperature Min(Tsmin)

- Temperature Max(Tsmax)

- Time(min to max)(ts)

Tsmax to TL

- Ramp-up Rate

Time maintained above:

- Temperature (TL)

- Time(tL)

Peak Temperature(TP)

Time within 5℃ of actual Peak

Temperature(TP)

Ramp-down Rate

Time 25℃ to Peak Temperature

Soldering Condition

<3℃/sec

150℃

200℃

60~120sec

<3sec

217℃

60-260sec

255 -0/+5℃

10~30sec

<6℃/sec

<6minutes

WEITRON

4/5

http://www.weitron.com.tw

05-May-2016

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