Features
• 300W Peak Pulse Power (tp = 8×20µs)
• Transient Protection for Data Line to IEC61000-4-2 Level 4
(ESD), 8kV HBM
Contact: Discharge – ±30kV
Air: Discharge – ±30kV
• IEC 61000-4-4 (EFT)
• Low Leakage Current
• Surface Mount Package Ideally Suited for Automated Insertion
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
DLPT05
SURFACE MOUNT DATALINE PROTECTION DEVICE
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
Leadframe).
• Terminal Connections: See Diagram
• Marking Information: See Page 1
• Ordering Information: See Page 1
• Weight: 0.008 grams (Approximate)
GROUND
TVS
Top View
LINE TO
VCC
BE PROTECTED
Device Schematic
Ordering Information (Note 4)
Notes:
Part Number
DLPT05-7-F
Case
SOT23
Packaging
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds
4. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
A01
A01 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: G = 2019)
M = Month (ex: 9 = September)
Date Code Key
Year
1998
1999
2000
2001
…
2019
Code
J
K
L
M
…
G
2020
H
2021
I
2022
J
Month
Code
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
Notes:
5. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DLPT05
Document number: DS30310 Rev. 10 - 2
1 of 6
www.diodes.com
April 2019
© Diodes Incorporated