ATWINC1500B-MU 데이터 시트보기 (PDF) - Atmel Corporation

부품명

상세내역

제조사

ATWINC1500B-MU

IEEE 802.11 b/g/n Network Controller SoC

Atmel Corporation 

11 Reflow Profile Information

This chapter provides guidelines for reflow processes in getting the Atmel module soldered to the customer’s

design.

11.1 Storage Condition

11.1.1 Moisture Barrier Bag Before Opened

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.

The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed.

11.1.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, <30%.

11.2

Stencil Design

The recommended stencil is laser-cut, stainless-steel type with thickness of 100µm to 130µm and

approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper with

bottom opening 25µm larger than the top can be utilized. Local manufacturing experience may find other

combinations of stencil thickness and aperture size to get good results.

11.3

Baking Conditions

This module is rated at MSL level 3. After sealed bag is opened, no baking is required within 168 hours so long

as the devices are held at ≤30°C/60% RH or stored at <10% RH.

The module will require baking before mounting if:

 The sealed bag has been open for >168 hours

 Humidity Indicator Card reads >10%

 SIPs need to be baked for 8 hours at 125°C

11.4 Soldering and Reflow Condition

11.4.1 Reflow Oven

It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen atmosphere be

used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-ability and reduce

temperature gradient across the board. It can also enhance the appearance of the solder joints by reducing the

effects of oxidation.

The following bullet items should also be observed in the reflow process:

 Some recommended pastes include NC-SMQ® 230 flux and Indalloy® 241 solder paste made up of 95.5

Sn/3.8 Ag/0.7 Cu or SENJU N705-GRN3360-K2-V Type 3, no clean paste

 Allowable reflow soldering times: 2 times based on the following reflow soldering profile (see Figure 11-

1)

 Temperature profile: Reflow soldering shall be done according to the following temperature profile (see

Figure 11-1)

 Peak temp: 250°C

Atmel ATWINC1500B-MU [DATASHEET]

Atmel-42487B-ATWINC1500B-MU_Datasheet_03/2016

31 3

1

Share Link: