3.3V 4096k Nonvolatile SRAM with Battery Monitor
3.3V 4096k Nonvolatile SRAM with Battery Monitor
Secure Microprocessor Chip
Secure Microprocessor Chip
Secure Microprocessor Chip
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
PACKAGE OUTLINE, 2x2 UCSP
PACKAGE OUTLINE, 2x2 UCSP
PACKAGE OUTLINE, 40L THIN QFN 5x5x0.8mm BODY / 0.4mm LEAD PITCH
MARKETING OUTLINE - .300" SOIC 32 LEAD .050" PITCH
MARKETING OUTLINE - 16L CHIP SCALE BGA (4X4) 1.0MM PITCH, 1.41 THICK, 2 LAYER
4-Tap Silicon Delay Line for RISC Applications
4-Tap Silicon Delay Line for RISC Applications
4-Tap Silicon Delay Line for RISC Applications
4-Tap Silicon Delay Line for RISC Applications
4-Tap Silicon Delay Line for RISC Applications
4-Tap Silicon Delay Line for RISC Applications
4-Tap Silicon Delay Line for RISC Applications
3-Volt 5-Tap Economy Timing Element (Delay Line)