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HMP8156(1997) View Datasheet(PDF) - Intersil

Part Name
Description
Manufacturer
HMP8156
(Rev.:1997)
Intersil
Intersil Intersil
HMP8156 Datasheet PDF : 33 Pages
First Prev 31 32 33
HMP8156
Metric Plastic Quad Flatpack Packages (MQFP/PQFP)
-A-
E E1
PIN 1
-H-
0.40
0.016 MIN
0o MIN
0o-7o
L
D
D1
-D-
-B-
e
SEATING
A PLANE
5o-16o
A2 A1
0.10
0.004
-C-
0.20
0.008
M
C
A-B S
DS
B
B1
5o-16o
0.13/0.17
0.005/0.007
BASE METAL
WITH PLATING
0.13/0.23
0.005/0.009
Q64.14x14 (JEDEC MO-108BD-2 ISSUE A)
64 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.130
-
3.30
-
A1
0.004 0.010 0.10
0.25
-
A2
0.100 0.120 2.55
3.05
-
B
0.012 0.018 0.30
0.45
6
B1
0.012 0.016 0.30
0.40
-
D
0.667 0.687 16.95 17.45
3
D1
0.547 0.555 13.90 14.10
4, 5
E
0.667 0.687 16.95 17.45
3
E1
0.547 0.555 13.90 14.10
4, 5
L
0.026 0.037 0.65
0.95
-
N
64
64
7
e
0.032 BSC
0.80 BSC
-
Rev. 0 1/94
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane -H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
33

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