CXA1871S View Datasheet(PDF) - Sony Semiconductor

Part Name

Description

Manufacturer

CXA1871S

NTSC/PAL Y/C/Jungle

Sony Semiconductor 

Package Outline Unit : mm

48PIN SDIP (PLASTIC)

+ 0.4

43.2 – 0.1

48

25

1

24

1.778

CXA1871S

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

Two kinds of package surface:

1.All mat surface type.

2.Center part is mirror surface.

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-48P-02

SDIP048-P-0600

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

5.1g

—46—

Share Link: