ESDA14V2-4BF1 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ESDA14V2-4BF1 Datasheet PDF : 9 Pages
| |||
ESDA14V2-4BF1
ORDER CODE
ESDA
ESD ARRAY
14V2
VBR min
-4B F 1
Pitch & bump
Nb of lines
Flip-Chip
Bidirectional
PACKAGE MECHANICAL DATA
700 ± 50
315 ± 50
650 ± 65
495 ± 50
1150 ± 50
FOOT PRINT RECOMMENDATIONS
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
8/9
MARKING
Dot, ST logo
xx = marking
z = back-end plant
yww = datecode
(y = year
ww = week)
All dimensions in µm
265
200
®
diam 230
XXZ
220
40
YWW
1150
®
Share Link: 