CD4532BMS View Datasheet(PDF) - Intersil
Part Name
Description
Manufacturer
CD4532BMS Datasheet PDF : 9 Pages
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Applications (Continued)
CD4532BMS
1/4 CD4071BMS
D9
Q3’
D8
1/6 CD4069BMS
CD4532BMS
D7
EI GS
D7
Q2
Q2’
Q1
Q1’
1/4 CD4071BMS
D0
D0 Q0
Q0’
FIGURE 12. 0-TO-9 KEYBOARD ENCODER
TRUTH TABLE
INPUT
OUTPUT
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
GS Q3’ Q2’ Q1’ Q0’
1
X
X
X
X
X
X
X
X
X
0
1
0
0
1
0
1
X
X
X
X
X
X
X
X
0
1
0
0
0
0
0
1
X
X
X
X
X
X
X
1
0
1
1
1
0
0
0
1
X
X
X
X
X
X
1
0
1
1
0
0
0
0
0
1
X
X
X
X
X
1
0
1
0
1
0
0
0
0
0
1
X
X
X
X
1
0
1
0
0
0
0
0
0
0
0
1
X
X
X
1
0
0
1
1
0
0
0
0
0
0
0
1
X
X
1
0
0
1
0
0
0
0
0
0
0
0
0
1
X
1
0
0
0
1
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
X = Don’t Care
Logic 1 ≡ High
Logic 0 ≡ Low
Chip Dimensions and Pad Layout
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
7-1235
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