HCTS365K View Datasheet(PDF) - Intersil

Part Name

Description

Manufacturer

HCTS365K

Radiation Hardened Hex Buffer/Line Driver Non-Inverting

Intersil 

HCTS365MS

Die Characteristics

DIE DIMENSIONS:

108 x 106 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

Y1

A1

(3)

(2)

HCTS365MS

OE1

(1)

VCC

(16)

OE2

(15)

A2 (4)

Y2 (5)

NC

A3 (6)

NC

(14) A6

(13) Y6

(12) A5

(11) Y5

NC

(7)

Y3

(8)

NC

GND

(9)

(10)

Y4

A4

NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS365 is TA14413A.

Spec Number 518637

10

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