POLYFUSEĀ® Resettable PTCs
Surface Mount > 1206L Series
Soldering Parameters
Condition
Peak Temp/ Duration Time
Time above liquids (TAL) 220Ā°C
Preheat 120Ā°C~ 180Ā°C
Storage Condition
Reļ¬ow
260Ā°C / 10 Sec
60 Sec ~ 100 Sec
50 Sec ~ 150 Sec
0Ā°C~35Ā°C, 70%RH
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oven, N2 environment for leadāfree
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solvents.
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devices may not meet the performance requirements.
Physical Speciļ¬cations
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin (Sn))
Lead Solderability
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ANSI/J-STD-002 Category 3.
Soldering
260
220
Preheating
180
120
Cooling
0
50 to 150
60 to 100
120
Time(s)
Environmental Speciļ¬cations
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
-40Ā°C to +85Ā°C
125Ā°C
+85Ā°C, 1000 hours
-/+5% typical resistance change
Humidity Aging
+85Ā°C, 85%, R.H.,1000 hours
-/+5% typical resistance change
Thermal Shock
MILāSTDā202, Method 107G
+85Ā°C/-40Ā°C 20 times
-30% typical resistance change
Solvent Resistance
MILāSTDā202, Method 215
No change
Vibration
MILāSTDā883C, Method 2007.1,
Condition A
No change
Moisture Sensivity Level Level 1, JāSTDā020C
Ā©2009 Littelfuse, Inc.
Speciļ¬cations are subject to change without notice.
Please refer to www.littelfuse.com/series/1206L.html for current information.
Revised: May 26, 2009
1206L Series