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HT9015 View Datasheet(PDF) - Holtek Semiconductor

Part Name
Description
Manufacturer
HT9015
Holtek
Holtek Semiconductor Holtek
HT9015 Datasheet PDF : 23 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Preliminary
HT9015
Pin No. Pin Name
32
AF_OUT
33
QUAD
34
IF_OUT
35
GND1
36
DEC
37
IF_IN
38
VCC1
39
2NDMIX_OUT
40
N_REC
41
2NDMIX_IN
42
E_RECT
43
1STMIX_OUT
44
VREF
45
1STMIX_IN
46
VCC2
47
VCO_CONT
48
VCO1
I/O
Description
O
FM demodulator output pin. Output signal frequency is within
the audio band.
I
Normally provides a 455kHz carry frequency for the FM quadra-
ture detector.
O
IF amplifier output pin. Signal will later pass through external
90°C phase shifter for quadrature detector.
¾ Analog ground
¾ Normally connected to VCC1 through a capacitor.
I
IF amplifier input pin it is necessary to use the IF filter network
to get high quality IF signal.
¾ Analog power supply
O
Second mixer IF signal output pin and down converter. IF fre-
quency is 455kHz.
¾ Connect to ground through capacitor.
I
Second mixer RF signal input pin and down converter. Fre-
quency is 455kHz.
¾ Expander rectifier filter capacitor pin.
O
First mixer IF signal output pin and down converter. IF fre-
quency is 10.7MHz.
O Reference voltage input for compander.
I
The first mixer RF signal input. Carrier frequency from
20~60MHz.
¾ Directly connects to the two voltage regulators inside.
I Normally connected to ground through a capacitor.
I
Connects LC network with VCO2 pin to provide the tank circuit
for the received voltage control oscillator.
Absolute Maximum Ratings
Supply Voltage...........................VSS-0.3V to 6V
Input Voltage .................VSS-0.3V to VCC+0.3V
Storage Temperature.................-55°C to 150°C
Operating Temperature ..............-20°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
5
April 10, 2000

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