Philips Semiconductors
Rotational speed sensor
Product specification
KMI15/4
PACKAGE OUTLINE
Plastic single-ended multi-chip package;
magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads
SOT453C
M1
vM A B
HE1
B
E
K
A
Q
L1
bp1
A
D
D2
L
L3
M2
vM A B
M3
E1
SENSOR DIE POSITION
HE
* centre of reading point
D1
L2
1
2
bp
e
c
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A(1) bp bp1 c D(2) D1(2) D2(2) E(2) E1(2) e
HE
HE1
K
max.
L
L1 L2 L3 M1 M2 M3(1) Q
v
mm
1.7
1.4
0.8 1.57 0.3 4.1
0.7 1.47 0.24 3.9
5.7 3.15 4.5
5.5 2.95 4.3
5.7
5.5
4.6
4.4
18.2
17.8
5.6
5.5
3.87
7.55
7.25
1.2
0.9
3.9
3.5
6.55
6.35
5.65
5.35
5.65
5.35
3.15
2.85
0.75
0.65
0.25
Notes
1. Glue thickness not included.
2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT453C
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-09-23
00-08-31
2000 Sep 05
11