UPD4726GS-BAF View Datasheet(PDF) - NEC => Renesas Technology

Part Name

Description

Manufacturer

UPD4726GS-BAF

RS-232 LINE DRIVER/RECEIVER

NEC => Renesas Technology 

µPD4726

RECOMMENDED SOLDERING CONDITIONS

Solder and mount the µPD4726 under the following recommended conditions.

Consult NEC for conditions other than those recommended.

µPD4726GS-BAF

Soldering method

Infrared ray reflow

VPS

Wave soldering

Partial heating

Soldering conditions

Peak temperature of package surface: 235 °C,

Reflow time: Within 30 sec (210 °C or higher),

Number of reflow process: 2, Exposure limit: None Note

Peak temperature of package surface: 215 °C,

Reflow time: Within 40 sec (200 °C or higher),

Number of reflow process: 2, Exposure limit: None Note

Solder temperature: 260 °C or lower, Reflow time: Within 10 sec,

Number of reflow process: 1, Exposure limit: None Note

Pin temperature: 300 °C or lower, Time: Within 10 sec,

Exposure limit: None Note

Symbol

IR35-00-2

VP15-00-2

WS60-00-1

Note Exposure limit before soldering after dry-package is opened. Storage condition: 25 °C and relative humidity

at 65 % or less.

Caution Do not use two or more soldering methods in combination (except the partial heating method).

REFERENCE

Document name

Semiconductor Device Mounting Technology Manual

Quality grade on NEC Semiconductor Devices

NEC Semiconductor Device Reliability/Quality Control system

Document No.

IEI-1207

IEI-1209

IEI-1212

11

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