Package Dimensions—100-Pin TQFP
L
L1
θ
c
GS841E18AT/B-166/150/130/100
e
b
A1 A2
Symbol
Description
A1
Standoff
A2
Body Thickness
B
Lead Width
C
Lead Thickness
D
Terminal Dimension
D1
Package Body
E
Terminal Dimension
E1
Package Body
E
Lead Pitch
L
Foot Length
L1
Lead Length
Y
Coplanarity
Q
Lead Angle
Notes:
1. All dimesnions are in millimeters (mm).
2. Package wideth and length do not include mold protrusion.
E1
E
Min.
Nom.
Max
0.05
0.10
0.15
1.35
1.40
1.45
0.20
0.30
0.40
0.09
0.20
21.9
22.0
22.1
19.9
20.0
20.1
15.9
16.0
16.1
13.9
14.0
14.1
0.65
0.45
0.60
0.75
1.00
0.10
0°
7°
Rev: 1.00 10/2001
26/29
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.