GL390V View Datasheet(PDF) - Sharp Electronics

Part Name

Description

Manufacturer

GL390V

Thin Bow Type Resin Mold Package Infrared Emitting Diodes

Sharp Electronics 

GL390/GL390V

s Features

1. Thin bow type resin mold package

(Resin area : 2.0 x 3.1 x 5.2 mm)

2. Low peak forward voltage ( GL390V)

VFM : TYP. 1.9V at IFM=0.5A

s Applications

1. Cameras

2. Infrared remote controllers

GL390/GL390V

Thin Bow Type Resin Mold

Package Infrared Emitting Diodes

s Outline Dimensions

(Unit : mm)

φ 3.8 ± 0.3 g 1

2.0

+

-

0.1

0.3

1

φ 3.1 Epoxy resin

2 - 0.5 ± 0.1

1

2

2

1 Anode

2 Cathode

2 - 0.5 ± 0.1

(2.54)

* Tolerance : ± 0.2mm

GL390

GL390V

g 1 Resin type

Pale blue transparent resin

Blue transparent resin

s Model Lineup

Model

Radiant intensity (mW/sr)

Half intensity angle (˚ )

GL390

GL390V

TYP. 13

TYP. 16

TYP. ± 18

s Absolute Maximum Ratings

(Ta=25˚C)

Parameter

Forward current

*1Peak forward current

Reverse voltage

Power dissipation

Operating temperature

Storage temperature

*2Soldering temperature

Symbol Rating Unit

IF

60

mA

I FM

1

A

VR

6

V

P

150

mW

T opr - 25 to 85 ˚C

T stg - 40 to 85 ˚C

T sol

260

˚C

*1 Pulse width <=100µ s, Duty ratio=0.01

*2 For 3 seconds at the position of 2.6 mm from the resin edge

“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,

data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”

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