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MSM98P05 View Datasheet(PDF) - Oki Electric Industry

Part Name
Description
Manufacturer
MSM98P05 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
¡ Semiconductor
PACKAGE DIMENSIONS
DIP20-P-300-2.54-W1
MSM98P05
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.50 TYP.
12/13

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