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TDA2025B View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TDA2025B
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA2025B Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
TEA2025B - TEA2025D
Stability
A good layout is recommended in order to avoid
oscillations.
Generally the designer must pay attention on the
following points:
- Short wires of components and short connec-
tions.
- No ground loops.
- Bypass of supply voltage with capacitors as
nearest as possible to the supply I.C.pin.The
low value(poliester)capacitors must have
good temperature and frequency charac-
teristics.
- No sockets.
2) the heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no device damage in the case of ex-
cessive junction temperature: all that happens
is that PO (and therefore Ptot) and Id are re-
duced.
APPLICATION SUGGESTION
The recommended values of the components are
those shown on stereo application circuit of
Fig. 2 different values can be used, the follow-
ing table can help the designer.
COMPONENT
C1,C2
C3
C4,C5
C6,C7
C8,C9
C10, C11
RECOMMENDED
VALUE
0.22µF
100µF
PURPOSE
INPUT
DC
DECOUPLING IN
CASE OF SLIDER
CONTACT NOISE OF
VARIABLE
RESISTOR
RIPPLE REJECTON
100µF
470µF
0.15µF
100µF
BOOTSTRAP
OUTPUT
DC
DECOUPLING
FREQUENCY
STABILITY
INVERTING INPUT
DC DECOUPLING
LARGER THAN
SMALLER THAN
DEGRADATION OF
SVR, INCREASE OF
THD AT LOW
FREQUENCY AND
LOW VOLTAGE
INCREASE OF LOW
FREQUENCY CUT-
OFF
DANGER
OF
OSCILLATIONS
INCREASE OF LOW
FREQUENCY CUT-
OFF
6/9

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